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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Truth Tables
Table 50: CKE Truth Table (Continued)
Notes 1–5 apply to all parameters and conditions; L = LOW, H = HIGH, X = “Don’t Care”
Command
Current State
Deep power-
CKE n -1
L
CKE n
L
CS#
X
n
X
Operation n
Maintain deep power-down
Next State
Deep
Notes
down
power-down
L
H
H
NOP
Exit deep power-down
Power-on
9
Self refresh
L
L
X
X
Maintain self refresh
Self refresh
L
H
H
NOP
Exit self refresh
Idle
10, 11
Bank(s) active
H
L
H
NOP
Enter active power-down
Active
power-down
All banks idle
H
L
H
NOP
Enter idle power-down
Idle
power-down
H
L
L
Enter self
Enter self refresh
Self refresh
refresh
H
L
L
DPD
Enter deep power-down
Deep
power-down
Resetting
H
L
H
NOP
Enter resetting power-down
Resetting
power-down
Other states
H
H
Refer to the command truth table
Notes:
1. Current state = the state of the device immediately prior to the clock rising edge n .
2. All states and sequences not shown are illegal or reserved unless explicitly described
elsewhere in this document.
3. CKE n = the logic state of CKE at clock rising edge n ; CKE n -1 was the state of CKE at the
previous clock edge.
4. CS#= the logic state of CS# at the clock rising edge n .
5. Command n = the command registered at clock edge n , and operation n is a result of
command n .
6. Power-down exit time ( t XP) must elapse before any command other than NOP is issued.
7. The clock must toggle at least twice prior to the t XP period.
8. Upon exiting the resetting power-down state, the device will return to the idle state if
t INIT5 has expired.
9. The DPD exit procedure must be followed as described in Deep Power-Down (page 101).
10. Self refresh exit time ( t XSR) must elapse before any command other than NOP is issued.
11. The clock must toggle at least twice prior to the t XSR time.
Table 51: Current State Bank n to Command to Bank n Truth Table
Notes 1–5 apply to all parameters and conditions
Current State
Any
Command
NOP
Operation
Continue previous operation
Next State
Current state
Notes
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
107
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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